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Flex-rigid board technology has matured and is now being produced at scale, offering both rigidity and flexibility to meet the demands of high-end applications across multiple industries.


In 2026, the rigid-flex PCB industry entered a period of rapid growth, with the global market continuing to expand and maintaining a compound annual growth rate of over 10%.

In 2026, the rigid-flex PCB industry entered a period of rapid growth, with the global market continuing to expand and maintaining a compound annual growth rate of over 10%. This product combines the structural stability of rigid PCBs with the flexibility and bendability of FPCs, addressing the pain points of poor spatial adaptability and insufficient structural strength associated with single-board solutions. It enables the implementation of multi-layer precision circuits, blind and buried vias, and high-frequency, high-speed routing. Currently, these boards have penetrated high-end sectors such as new energy vehicle electronic control modules, smart wearable devices, precision medical devices, industrial control systems, and in-vehicle displays on a large scale. Rigid-flex boards featuring ultra-fine lines, high layer counts, and superior heat dissipation have become the mainstream focus of R&D. Continuous breakthroughs are being made in fine-line-width and fine-pitch manufacturing processes, while automotive-grade and medical-grade reliability certifications have become core competitive advantages in the industry.

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